TWG Grand Park Village, LLC

254900VDSFYD9PC2R470

The entity

Country: United States
Legal address: c/o C T Corporation System, 334 North Senate Avenue46204 IndianapolisUnited States (US-IN)
Head office: 1301 E. Washington St., Suite 10046202 IndianapolisUnited States (US-IN)

LEI: 254900VDSFYD9PC2R470
Registered: September 23, 2025 at 12:10 PM UTC
Last updated: September 23, 2025 at 12:10 PM UTC
Next renewal: September 23, 2026 at 12:10 PM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Business Services Division (Secretary of State) (RA000609)
Identifier: 202205181593354
Verified against: Business Services Division (Secretary of State) (RA000609)
Verified as: 202205181593354
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

REST: https://lei.online/v1/entities/254900VDSFYD9PC2R470This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.