PLATING TECHNOLOGY, INC.

254900U2ON4Y9O9OM906

The entity

Status: Active
LEI status: Lapsed - not renewed
Category: Company
Legal form: Corporation (For-Profit) (BTQ1)
Jurisdiction: US-OH
Entity created: January 6, 1953

Address

Country: United States
Legal address: c/o MATT RASKIN, 1525 W. RIVER ROAD45417 DAYTONUnited States (US-OH)
Head office: 1525 West River Road45417 DaytonUnited States (US-OH)

Identifier

LEI: 254900U2ON4Y9O9OM906
Registered: March 25, 2020 at 09:04 PM UTC
Last updated: February 28, 2025 at 01:30 PM UTC
Next renewal: February 27, 2025 at 07:03 PM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Corporation Database (Ohio Secretary of State) (RA000629)
Identifier: 231403
Verified against: Corporation Database (Ohio Secretary of State) (RA000629)
Verified as: 231403
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: No owner is known to control it

Machine access

REST: https://lei.online/v1/entities/254900U2ON4Y9O9OM906This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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