HEYGEN TECHNOLOGY INC.

254900TNIQUNMZAAVT68

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Corporation (XTIQ)
Jurisdiction: US-DE
Entity created: July 5, 2022

Address

Country: United States
Legal address: C/O CORPORATION SERVICE COMPANY, 251 LITTLE FALLS DRIVE19808 WILMINGTONUnited States (US-DE)
Head office: 12130 MILLENNIUM DRIVE, SUITE 30090094 LOS ANGELESUnited States (US-CA)

Identifier

LEI: 254900TNIQUNMZAAVT68
Registered: March 12, 2026 at 10:42 AM UTC
Last updated: March 12, 2026 at 10:44 AM UTC
Next renewal: March 12, 2027 at 10:42 AM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Division of Corporations, Department of State (RA000602)
Identifier: 6893980
Verified against: Division of Corporations, Department of State (RA000602)
Verified as: 6893980
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: The parent has no LEI

Machine access

REST: https://lei.online/v1/entities/254900TNIQUNMZAAVT68This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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