Stats Chippac Pte Ltd

254900S2HH22EA4E3664

The entity

Status: Active
LEI status: Lapsed - not renewed
Category: Company
Legal form: Private Company Limited by Shares (IWZF)
Jurisdiction: Singapore
Entity created: May 9, 2018

Address

Country: Singapore
Legal address: 10 Ang Mo Kio Street 65, #04-08/09 Techpoint569059 SingaporeSingapore

Identifier

LEI: 254900S2HH22EA4E3664
Registered: May 9, 2018 at 11:37 AM UTC
Last updated: March 2, 2026 at 08:14 PM UTC
Next renewal: May 9, 2019 at 11:37 AM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Business Registry (RA000523)
Identifier: 199407932D
Verified against: Business Registry (RA000523)
Verified as: 199407932D
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: The parent has no LEI

Machine access

REST: https://lei.online/v1/entities/254900S2HH22EA4E3664This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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