LenderMatch LLC

254900RYOWT72YVSF759

The entity

Country: United States
Legal address: C/O RANDOLPH MILES, 3426 WHEATLAND CIR60134-4675 GENEVAUnited States (US-IL)
Head office: 3426 Wheatland Circle60134 GenevaUnited States (US-IL)

LEI: 254900RYOWT72YVSF759
Registered: December 30, 2024 at 02:23 PM UTC
Last updated: December 31, 2025 at 01:30 PM UTC
Next renewal: December 30, 2025 at 02:23 PM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Business Services (Office of the Secretary of State) (RA000608)
Identifier: 12224494
Verified against: Business Services (Office of the Secretary of State) (RA000608)
Verified as: 12224494
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

No direct parent reportedNo ultimate parent reported: The parent is one or more private individuals

REST: https://lei.online/v1/entities/254900RYOWT72YVSF759This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.