2201 S. Halsted LLC

254900LWMWC6945WFT59

The entity

Country: United States
Legal address: c/o Barnett Ruttenberg, 824 Judson Ave60035 Highland ParkUnited States (US-IL)
Head office: 55 E. Jackson Blvd., Suite 50060604 ChicagoUnited States (US-IL)

LEI: 254900LWMWC6945WFT59
Registered: June 28, 2021 at 03:31 PM UTC
Last updated: June 29, 2022 at 01:31 PM UTC
Next renewal: June 28, 2022 at 03:31 PM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Business Services (Office of the Secretary of State) (RA000608)
Identifier: 04774019
Verified against: Business Services (Office of the Secretary of State) (RA000608)
Verified as: 04774019
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

No direct parent reportedNo ultimate parent reported: The accounts are not published

REST: https://lei.online/v1/entities/254900LWMWC6945WFT59This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.