MORGAN PARK, LTD.

254900HJUMG0K3KVN858

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Limited Liability Company (EZNQ)
Jurisdiction: US-OH
Entity created: August 15, 2003

Address

Country: United States
Legal address: C/O K&D MANAGEMENT, LLC, 4420 SHERWIN ROAD44094 WILLOUGHBYUnited States (US-OH)
Head office: 4420 SHERWIN ROAD44094 WILLOUGHBYUnited States (US-OH)

Identifier

LEI: 254900HJUMG0K3KVN858
Registered: June 24, 2025 at 08:06 AM UTC
Last updated: May 26, 2026 at 06:20 AM UTC
Next renewal: June 24, 2027 at 08:06 AM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Corporation Database (Ohio Secretary of State) (RA000629)
Identifier: 1405497
Verified against: Corporation Database (Ohio Secretary of State) (RA000629)
Verified as: 1405497
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: The parent has no LEI

Machine access

REST: https://lei.online/v1/entities/254900HJUMG0K3KVN858This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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