日昇實業有限公司

254900FWB05FEUQA3754

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: 私人股份有限公司 (254M)
Jurisdiction: Hong Kong SAR China
Entity created: December 31, 1971

Address

Country: Hong Kong SAR China
Legal address: 20/F., Sunbeam Plaza, 1155 Canton Road, Kowloon999077 Hong KongHong Kong SAR China

Identifier

LEI: 254900FWB05FEUQA3754
Registered: August 21, 2020 at 05:12 PM UTC
Last updated: September 3, 2026 at 06:15 AM UTC
Next renewal: September 3, 2027 at 06:15 AM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: 香港稅務局轄下的商業登記署 (RA000389)
Identifier: 03437549
Verified against: 香港稅務局轄下的商業登記署 (RA000389)
Verified as: 03437549
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: The parent has no LEI

Machine access

REST: https://lei.online/v1/entities/254900FWB05FEUQA3754This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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