LENDZEN INC.

254900EOYK0UXLROBX92

The entity

Country: United States
Legal address: C/O JONATHAN E. KUTSMEDA, 500 ALA MOANA BLVD, SUITE 740096813 HONOLULUUnited States (US-HI)
Head office: 500 ALA MOANA BLVD, SUITE 740096813 HONOLULUUnited States (US-HI)

LEI: 254900EOYK0UXLROBX92
Registered: September 22, 2017 at 04:01 AM UTC
Last updated: January 28, 2026 at 04:09 AM UTC
Next renewal: February 10, 2027 at 08:50 PM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Business Registration Division (Department of Commerce & Consumer Affairs) (RA000605)
Identifier: 227733 D1
Verified against: Business Registration Division (Department of Commerce & Consumer Affairs) (RA000605)
Verified as: 227733 D1
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

No direct parent reportedNo ultimate parent reported: The parent is one or more private individuals

REST: https://lei.online/v1/entities/254900EOYK0UXLROBX92This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.