Wood's Lincoln, LLC

254900D1PXTTHVUYSG44

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Limited Liability Company (EZNQ)
Jurisdiction: US-OH
Entity created: December 20, 2010

Address

Country: United States
Legal address: C/O MARK C. WOOD, 21 W. HUBBARD AVENUE, SUITE D43215 COLUMBUSUnited States (US-OH)
Head office: 939 N High St, Suite 20643201 ColumbusUnited States (US-OH)

Identifier

LEI: 254900D1PXTTHVUYSG44
Registered: July 27, 2026 at 02:23 PM UTC
Last updated: July 27, 2026 at 02:23 PM UTC
Next renewal: July 27, 2027 at 02:23 PM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Corporation Database (Ohio Secretary of State) (RA000629)
Identifier: 1984125
Verified against: Corporation Database (Ohio Secretary of State) (RA000629)
Verified as: 1984125
Corroboration: Confirmed against a public register

Corporate structure

Owned by

WOOD'S HIGH STREET, LTD.
Direct parent · Ultimate parentUnited States5493002Z7SOXPG3RNJ42

Machine access

REST: https://lei.online/v1/entities/254900D1PXTTHVUYSG44This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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