称上海高仙自动化科技发展股份有限公司

254900CZQQ3D2GPZ4R23

The entity

Country: China
Legal address: 号4幢10层, 盛夏路 666号、银冬路122号, 中国(上海)自由贸易试验区201210 上海China (CN-SH)

LEI: 254900CZQQ3D2GPZ4R23
Registered: February 24, 2026 at 10:00 AM UTC
Last updated: February 24, 2026 at 11:56 AM UTC
Next renewal: February 24, 2027 at 10:00 AM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: National Enterprise Credit Information Publicity System (RA000092)
Identifier: 91310115080028627C
Verified against: National Enterprise Credit Information Publicity System (RA000092)
Verified as: 91310115080028627C
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

REST: https://lei.online/v1/entities/254900CZQQ3D2GPZ4R23This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.