CSOP ENHANCED BOND FUND

254900BNPGP66YZV9H47

The entity

Status: Active
LEI status: Issued and current
Category: Fund
Legal form: 8888
Jurisdiction: Hong Kong SAR China
Entity created: August 27, 2024

Address

Country: Hong Kong SAR China
Legal address: 2801-2803 & 3303-3304, Two Exchange Square, 8 Connaught Place, Central999077 Hong KongHong Kong SAR China
Head office: C/O CSOP Asset Management Limited, Suite 2801-2803, Two Exchange Square, 8 Connaught Place, Central and Western District999077 Hong KongHong Kong SAR China

Identifier

LEI: 254900BNPGP66YZV9H47
Registered: May 24, 2024 at 08:59 AM UTC
Last updated: April 1, 2026 at 01:17 PM UTC
Next renewal: April 24, 2027 at 08:59 AM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Securities and Futures Commission (RA000390)
Identifier: BUV354
Verified against: Securities and Futures Commission (RA000390)
Verified as: BUV354
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Owned by

南方東英資產管理有限公司
Fund managerHong Kong SAR China549300HNJMXMN92LZ393
CSOP FUND SERIES OFC
Umbrella fundHong Kong SAR China254900227ZORC7TRZB83

Why no parent is reported

No direct parent reportedNo ultimate parent reported: No parent prepares consolidated accounts including it

Machine access

REST: https://lei.online/v1/entities/254900BNPGP66YZV9H47This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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