HI-TECH MOLD & ENGINEERING, INC.

254900AKEZQSI6FQEQ05

The entity

Country: United States
Legal address: C/O ROBERT SCHULTE, 2775 COMMERCE48309 ROCHESTER HILLSUnited States (US-MI)
Head office: 2775 COMMERCE48309 ROCHESTER HILLSUnited States (US-MI)

LEI: 254900AKEZQSI6FQEQ05
Registered: March 24, 2023 at 10:20 AM UTC
Last updated: January 16, 2026 at 03:29 PM UTC
Next renewal: January 24, 2027 at 10:20 AM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Corporations Division (Department of Licensing and Regulatory Affairs) (RA000616)
Identifier: 800309661
Verified against: Corporations Division (Department of Licensing and Regulatory Affairs) (RA000616)
Verified as: 800309661
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

No direct parent reportedNo ultimate parent reported: No parent prepares consolidated accounts including it

REST: https://lei.online/v1/entities/254900AKEZQSI6FQEQ05This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.