NextGen Mold Technologies Windsor Inc.

2549009GKZ31Y5KALY94

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Business corporations (which includes professional corporations) (O90R)
Jurisdiction: CA-ON
Entity created: January 10, 2022

Address

Country: Canada
Legal address: 3293 St. Etienne Blvd.N8W 5B1 WindsorCanada (CA-ON)

Identifier

LEI: 2549009GKZ31Y5KALY94
Registered: July 11, 2024 at 03:22 PM UTC
Last updated: June 12, 2026 at 03:32 PM UTC
Next renewal: July 11, 2027 at 03:22 PM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Corporate Registry (Province of Ontario) (RA000079)
Identifier: 1000077358
Verified against: Corporate Registry (Province of Ontario) (RA000079)
Verified as: 1000077358
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: The parent has no LEI

Machine access

REST: https://lei.online/v1/entities/2549009GKZ31Y5KALY94This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

Start a new search