HIGHLAND PARK BUILDING IV LLC

2549000YI8E1RB95OT91

The entity

Country: United States
Legal address: C/O INCORP SERVICES, INC, 901 S 2ND ST, STE 201, SPRINGFIELD62704-7909 ChicagoUnited States (US-IL)
Head office: 2320 N Damen Avenue, Suite 1D60647 ChicagoUnited States (US-IL)

LEI: 2549000YI8E1RB95OT91
Registered: July 6, 2023 at 01:36 PM UTC
Last updated: July 7, 2024 at 01:30 PM UTC
Next renewal: July 6, 2024 at 01:36 PM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Business Services (Office of the Secretary of State) (RA000608)
Identifier: 02113961
Verified against: Business Services (Office of the Secretary of State) (RA000608)
Verified as: 02113961
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

No direct parent reportedNo ultimate parent reported: The parent is one or more private individuals

REST: https://lei.online/v1/entities/2549000YI8E1RB95OT91This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.