Medbond HK Limited

25490000K6MDL126EK06

The entity

Status: Active
LEI status: Lapsed - not renewed
Category: Company
Legal form: 私人股份有限公司 (254M)
Jurisdiction: Hong Kong SAR China
Entity created: August 11, 2017

Address

Country: Hong Kong SAR China
Legal address: Level 19, Two International Finance Center, 8 Finance Street, Central999077 Hong KongHong Kong SAR China
Head office: c/o MedBond Organisation, FLAT/RM A1-A7 2/F, Pahsang Industrial Building, 16 Sun on Street999077 Tuen MunHong Kong SAR China

Identifier

LEI: 25490000K6MDL126EK06
Registered: March 9, 2020 at 05:11 PM UTC
Last updated: May 8, 2024 at 11:20 AM UTC
Next renewal: February 17, 2024 at 07:43 PM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Companies Registry (RA000388)
Identifier: 68060533
Verified against: Companies Registry (RA000388)
Verified as: 68060533
Corroboration: Partly confirmed against a public register
GLEIF conformity: Does not meet the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: The parent is one or more private individuals

Machine access

REST: https://lei.online/v1/entities/25490000K6MDL126EK06This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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