BANZU COVERED BONDS PTE. LTD.

213800WQHGS85J2Y7829

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Private Company Limited by Shares (IWZF)
Jurisdiction: Singapore
Entity created: October 23, 2023

Address

Country: Singapore
Legal address: 77 ROBINSON ROAD, #13-00, ROBINSON 77068896 SINGAPORESingapore (SG-01)

Identifier

LEI: 213800WQHGS85J2Y7829
Registered: October 31, 2023 at 12:00 AM UTC
Last updated: September 8, 2026 at 11:43 AM UTC
Next renewal: October 31, 2027 at 12:00 AM UTC
Issuer: London Stock Exchange (213800WAVVOPS85N2205)
Registered with: Business Registry (RA000523)
Identifier: 202342228G
Verified against: Business Registry (RA000523)
Verified as: 202342228G
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: No parent prepares consolidated accounts including it

Machine access

REST: https://lei.online/v1/entities/213800WQHGS85J2Y7829This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

Start a new search